摘要：介绍了适用于尼龙(PA)基材的新型前处理工艺。经过胯胀、调校、钯活化、还原、化学镍δ=0．3μm)、预镀镍或铜(δ=2～5 μm)、酸铜(δ=20μm)、光亮镍δ=12 μm)、装饰铬(δ=0．3μm)等工艺后，可在尼龙表面获得结合力良好的装饰性镪层。该工艺为开发尼龙塑料在电镀业的应用迈出了重要的一步。
关键词：尼龙；电镀；前处理；装饰性镀层
中图分类号：TGl78；TQl53．3 文献标志码：A
文章编号：1004-227X(2009)09-0014-02
Pretreatment for electroplating of polyamide(PAl substrates//BRANDES Maja-Mariola，FELS Carl Christian KO Danny*
Abstract：A reliable process for the pretreatment ol polyamides(PA)for metal plating was described．B) applying swelling，conditioning，Pd activation，reduction． electroless nickel layer(δ=0．3μm)，Ni or Cu strike layer(δ=2-5μm)，acid copper layer(J=20μm)，bright nickel layel(δ=12μm)and bright chrome layer(δ=0．3μm)，a decorative coating with good adhesion Can be obtained on specific type of PA surface．This is a significant step for the developmenl and application of the metal plating of polyamides．
Keywords：polyamide; electroplating；pretreatment； decorative coating layer
First．author"S address：Atotech Deutschland GmbH． Berlin，Germany
