摘 要:Thermal barrier coatings have been used on high temperature components. Due to high stresses leading to unpredictable failure, a transient thermal-structural finite element solution was employed to analyze the stress distribution and J-integral at the interface between the bond coating and thermally growing oxide(TGO) in the EB-PVD thermal barrier coatings subjected to thermal loadings. The effects of some environmental and material parameters were studied, such as thermal convection coefficient, ceramic elastic modulus and TGO thickness. The results show that the stresses and J-integral values are impacted by these parameters.
Finite element analysis of stresses and interface crack in TBC systems.pdf
